III · Science
Copper Electrodeposition For Nanofabrication Of Electronics Devices
Subjects
Nanostructured materials · Nanotechnology · Copper plating · Solid state physics · Electrochemistry · Chemistry
Language
ENG
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![Cover of [William Wheeler Hubbell, authorized to apply for patents.] by United States. Congress. Senate. Committee on Patents](/img/cover/10200621-M.jpg)
